发明名称 HEAT TREATMENT EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide heat treatment equipment wherein the temperature decrease speed in the vertical directions of a substrate to be processed can be kept, even while securing a large temperature decrease speed. SOLUTION: The heat treatment equipment comprises a reaction tube 1, a heat equalizer tube 17, and a heater 16 which are set up concentrically. The substrate 5 is heat-treated inside the reaction tube; a first space 18 is formed between the reaction tube and the heat equalizer tube, and a second space 19 is formed between the heat equalizer tube and the heater; a cooling gas is supplied into the first space and is exhausted through the upper end of the heat equalizer tube; and a cooling gas is supplied also into the second space from the external surface of the heater and a exhausted through the upper end of the heater.
申请公布号 JP2002164298(A) 申请公布日期 2002.06.07
申请号 JP20000362715 申请日期 2000.11.29
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 TANABE MIKIO;MIYATA TOSHIMITSU;SHIRATORI WAKAKO;KASATSUGU KATSUNAO;HOSAKA EIJI;ONO KENJI
分类号 F27D11/02;H01L21/205;H01L21/22;(IPC1-7):H01L21/22 主分类号 F27D11/02
代理机构 代理人
主权项
地址