| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method which is capable of forming a build-up type multilayer printed wiring board by using resin sheets with copper foil carry with good yield without wrinkle of a copper foil, floating of a pattern and generation of dents. SOLUTION: In a manufacturing method of a multilayer printed wiring board, a process performing thermocompression molding by sandwiching a member where resin sheets with copper foil carry are laminated on a single surface or both surfaces of an inner layer circuit board, in which conducting circuit patterns are previously formed on the single surface or both surfaces with metal mold plates is repeated, and wiring layers are laminated. A resin sheet with a masking copper foil where protective masking is given, e.g., a polyethylene terephthalate film is stuck on a copper surface of the copper foil carry is used as the resin sheet with a copper foil carry. |
