| 摘要 |
PROBLEM TO BE SOLVED: To improve an effective acquisition rate of a product by extending an effective area of a mold substrate. SOLUTION: In a method for manufacturing a semiconductor device where a plurality of sealed bodies, molded with resin collectively to be integrated, are cut to be separated into individual semiconductor devices, in the mold, a mold region 1C is partially projected and an injector pin 6 is arranged at this projected portion. Or, in a die 4 used in the mold, a cavity 4b is partially projected into a gate region 1b provided with a gate 4a for injecting resin into the cavity, and after the resin injection, by sticking the injector pin 6 out from the die to this projected portion, and the sealed bodies integrated with the projected portion is peeled from the die. This configuration can extend the effective area 1d for resin sealing immediately near the gate region, and thus the effective area of the mold substrate 1 extends and the number of product acquisition can be increased.
|
