| 摘要 |
A method for detecting the inclined status of a hot plate comprising selecting a sensitive photoresist coated on a wafer. A first wafer is positioned on a standard hot plate to perform a bake treatment. A stepping exposure with gradually changing light intensity is performed to obtain the minimum exposure energy of the thickness of the first photoresist layer. A second photoresist layer the same as the first wafer is coated on the surface of the second wafer, and positioned on a hot plate under test to perform a bake treatment. The second photoresist layer is exposed by a minimum exposure energy, thereby having the first photoresist layer being uniformly exposed or not to determine whether the hot plate under test is inclined or not.
|
