| 摘要 |
PROBLEM TO BE SOLVED: To provide anisotropic conductive paste which is superior in connection reliability and in addition, superior in insulation and humidity resistance between adjacent electrodes.SOLUTION: Anisotropic conductive paste according to the present invention is an anisotropic conductive paste used for connecting between wiring boards, or connecting an electronic component to a wiring board. The anisotropic conductive paste comprises (A)a thermoplastic resin, (B)a radical polymerizable resin, (C)a reactive diluent, (D)a radical polymerization initiator, (E)an activator and (F)solder powder. The particle diameter of the solder powder (F), and the least interval between wiring lines in a connection part of the wiring board satisfy the conditions represented by the following formulas (F1) and (F2): S≤100 μm (F1); and D≤S/4 (F2). In the formulas, S is a least interval between wiring lines in a junction part of the wiring board; and Drepresents a particle diameter when an accumulative volume fraction is 99% in a particle diameter distribution of the solder powder.SELECTED DRAWING: None |
