| 发明名称 |
CIRCUIT BOARD AND ELECTRONIC DEVICE UTILIZING THE SAME |
| 摘要 |
A circuit board includes a substrate defining a plurality of ground attaching holes and a plurality of first through-holes. The substrate includes a first surface and a side edge. Wherein, a plurality of parallel and spaced first conductive paths is formed on the first surface around each ground attaching hole. A first arcuate conductive portion is formed at each end of each first conductive path. An angle between each first conductive path and the side edge is 45° or 135°. The first through-holes respectively extend through the first arcuate conductive portions and electrically couple with the first conductive paths. |
| 申请公布号 |
US2016270228(A1) |
申请公布日期 |
2016.09.15 |
| 申请号 |
US201514695936 |
申请日期 |
2015.04.24 |
| 申请人 |
HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD ;HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
LUNG HSIEN-PEI;YU WU-ZHE |
| 分类号 |
H05K1/11;H05K5/00;H05K1/02 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit board comprising:
a substrate defining a plurality of ground attaching holes and a plurality of first through-holes, the substrate comprising a first surface and a side edge; wherein a plurality of parallel and spaced first conductive paths is formed on the first surface around each ground attaching hole, and a first arcuate conductive portion is formed at each end of each first conductive path, an angle between each first conductive path and the side edge is 45° or 135°, and the first through-holes extend through the first arcuate conductive portions and electrically couple with the first conductive paths. |
| 地址 |
Shenzhen CN |
