发明名称 |
Semiconductor package with improved thermal cycling performance, and method of forming same |
摘要 |
A semiconductor package includes a relatively thin substrate epoxy attached to a packaging substrate, such as a lead frame. A relatively thick semiconductor epoxy is attached to a semiconductor. The relatively thin substrate epoxy and the relatively thick semiconductor epoxy are attached to one another forming a stack including the packaging substrate, the relatively thin substrate epoxy, the relatively thick semiconductor epoxy, and the semiconductor. A housing encloses the stack.
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申请公布号 |
US6858942(B1) |
申请公布日期 |
2005.02.22 |
申请号 |
US20030635182 |
申请日期 |
2003.08.05 |
申请人 |
ALTERA CORPORATION |
发明人 |
CHEAH ENG-CHEW;ANDERSON SYDNEY LARRY |
分类号 |
H01L21/30;H01L21/58;H01L23/00;H01L23/31;H01L23/48;H01L23/52;H01L29/40;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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