发明名称 ELECTRICAL ASSEMBLIES
摘要 <p>An electrical circuit has a substrate 1 and a surface mount capacitor 3 having a connector pad 31, 32 at each end. The substrate 1 has two separate contact pads 10 and 11 that are both soldered to the same pad 31 on the capacitor 3. Two further pads 20 and 21 on the substrate 1 are soldered to the other pad 32 on the capacitor 3. The pads 10, 11, 20 and 21 on the substrate 1 are connected to tracks 13, 14, 23, 24 that extend to plated-through holes 15, 16, 25, 26 and are electrically connected to one another at a point remote from the capacitor 3. The presence of the two separate inductances carried by the pads 10 and 11 results in improved attenuation by the capacitor at higher frequencies, and the capacitor is therefore more effective at reducing interference. <IMAGE></p>
申请公布号 GB9321881(D0) 申请公布日期 1993.12.15
申请号 GB19930021881 申请日期 1993.10.22
申请人 SMITHS INDUSTRIES PLC 发明人
分类号 H05K1/02;H05K1/11;H05K3/34 主分类号 H05K1/02
代理机构 代理人
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