| 摘要 |
A semiconductor wafer is formed with a plurality of semiconductor chips each having a plurality of ICs or LSIs, a plurality of scribe lines formed between the semiconductor chip areas for dicing the plurality of ICs or LSIs as semiconductor chips, and a plurality of test elements formed on the scribe lines for testing the performance of basic elements and the quality of manufacturing processes. A plurality of slits intersecting with the scribe line are formed at a predetermined pitch in the test element serving as a test electrode a probe for electrical measurement contacts.
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