| 摘要 |
PROBLEM TO BE SOLVED: To receive a wafer from a conveyance device in a less space.SOLUTION: A wafer support part 74b of a wafer support unit 125 is rotated around one axis and thereby a wafer W conveyed to below a chuck unit 153 by a conveyance loader 149 is supported from below. Thereafter, the underside of the wafer W is sucked and held via a suction part 78. After the wafer W is held together with the chuck unit 153, the wafer W is placed on a wafer stage. Therefore, the rotation of the wafer support part 74b around the one axis makes it possible to receive the wafer W in a small space.SELECTED DRAWING: Figure 6 |
