发明名称 HEAT-RESISTANT INSULATING SUBSTRATE AND THERMAL HEAD
摘要 PURPOSE:To enhance a rigidity, reduce a failure occurrence ratio, prevent the crack of a wear-resistant layer, and improve a reliability by a method wherein an amorphous substance layer containing at least one of hydrogen and halogen and mainly composed of silicon and at least one selected from among nitrogen, carbon, and oxygen is provided as a resin protective layer or a wear-resistant layer. CONSTITUTION:On a metal substrate 1 made of Fe-Cr alloy or the like, a heat- resistant resin layer 2 serving as a heat-accumulation layer and also an insulating layer is formed. On the heat-resistant resin layer 2, a resin protective layer 3 made of an amorphous substance mainly composed of silicon and at least one of nitrogen, carbon, and oxygen and containing at least one of hydrogen and halogen in the ratio of 20atomic% or more is provided to form a heat- resistant insulating substrate 4. On this heat-resistant insulating substrate 4, a heating resistor 5 is formed. On the heating resistor 5, discrete electrodes 6 and a common electrode 7 are provided so as to form openings as a heat generation part. An adhesive layer 8 and a wear-resistant layer 9 serving also as an anti-oxidant film are formed so as to cover the openings as the heat generation part.
申请公布号 JPH0278573(A) 申请公布日期 1990.03.19
申请号 JP19880229808 申请日期 1988.09.16
申请人 TOSHIBA CORP 发明人 HONMA KATSUHISA;YAMAZAKI MUTSUKI
分类号 B41J2/335 主分类号 B41J2/335
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