| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package which can attempt strengthening of an electric power supply by shortening of wiring of a power source line by using a wire ring. SOLUTION: A plurality of bonding pads 3, 4, 15, 30 and 40 are arranged along both sides of the longitudinal direction of a semiconductor integrated circuit. The bonding pads 3, 4, 15, 30, and 40 are made to junction with an electrical power source wiring layer 5 and-an earth wiring layer 6 provided via a film coating 21 on the major surface of the semiconductor integrated circuit by using a wire ring. |
