| 摘要 |
PURPOSE:To improve bonding strength between a conductor and a ceramic substrate by adding 0-5weight% of copper compound powder to the total amount of a specific conductor paste composition to be baked. CONSTITUTION:A paste for surface conductor is formed on the surface of a green sheet or on that of a ceramic substrate which has been baked, while 0-5weight% of copper compound power is added to the total amount of a composition which is a baked conductor paste composition, and whose solid part is: 80-99.0weight% of Au powder, 0.1-20weight% of crystallized glass frit, and 0-19.9weight% of non-crystalline glass frit, where the crystallized glass frit and the non-crystalline glass frit are not more than 20weight%. The bonding strength of the conductor to the ceramic substrate can thus be improved, and the defect such as the crack or exfoliation of the conductor can be prevented. |
