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经营范围
发明名称
FLIP CHIP PACKAGE, CIRCUIT BOARD THEREOF AND PACKAGING METHOD THEREOF
摘要
申请公布号
KR20020030122(A)
申请公布日期
2002.04.22
申请号
KR1020027003675
申请日期
2002.03.20
申请人
发明人
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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