发明名称 Apparatus and method for broadband electromagnetic mode suppression in microwave and millimeterwave packages
摘要 A parallel plate waveguide structure may be configured to suppress spurious propagating modes by including a lossy frequency selective surface (FSS) formed from a resistive film. The electromagnetic material properties of individual layers disposed between the conductive plates of the waveguide may be engineered to extend the suppression band of the fundamental TE mode up to the cutoff frequency of the second TE mode, and to simultaneously create a multi-octave TM mode suppression band. Applications include, for example, cavity mode suppression in microwave and millimeterwave assemblies at the board, package, and chip level.
申请公布号 US9362601(B2) 申请公布日期 2016.06.07
申请号 US201514631088 申请日期 2015.02.25
申请人 WEMTEC, INC. 发明人 McKinzie, III William E.
分类号 H01P1/16;H05K1/02;H01P1/163;H01P1/20;H01P3/08;H01Q15/02;H05K1/16 主分类号 H01P1/16
代理机构 Brinks Gilson & Lione 代理人 Brinks Gilson & Lione
主权项 1. A package for an electrical circuit, comprising: a first conductive surface; a second conductive surface; a resistive layer disposed at a first fixed distance from the first conductive surface and a second fixed distance from the second conductive surface; a first dielectric material, having a relative dielectric constant greater than unity, disposed between the resistive layer and the first conductive surface; and a second dielectric material, having a relative dielectric constant greater than or equal to unity, disposed between the resistive layer and the second conductive surface, wherein the first distance, the second distance and the relative dielectric constants of dielectric layers disposed between the resistive layer and the conductive surfaces are selected such that propagation of a TE mode is suppressed in amplitude over a selected frequency interval; and, the resistive layer has an intrinsic resistance of at least 30 Ohms per square.
地址 Fulton MD US
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