发明名称 |
Chip-size integrated circuit package having slits formed in an insulator tape |
摘要 |
In a chip-size package, an insulator tape is formed with a conductive wire having a wider section which is greater in width than other sections of the wire and a conductive bump connected to the wider section of the wire. The insulator tape is further formed with a first plurality of slits arranged on one side of the wider section of the wire and a second plurality of slits arranged on the other side of the wider section. An integrated circuit chip is provided having a conductive pad connected to the copper bump.
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申请公布号 |
US6476482(B1) |
申请公布日期 |
2002.11.05 |
申请号 |
US20000588189 |
申请日期 |
2000.06.07 |
申请人 |
NEC CORPORATION |
发明人 |
OKAZAKI SHOHEI;MATSUMOTO YOSHIHIRO |
分类号 |
H01L23/12;H01L21/60;H01L23/31;H01L23/485;(IPC1-7):H01L23/12;H01L23/053 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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