| 摘要 |
A high-frequency module is integrally formed from at least some circuit components defining a first wireless system using a first frequency band and at least some circuit components defining a second wireless system using a second frequency band. The high-frequency module includes a multilayer substrate including a plurality of stacked dielectric layers, a first terminal group disposed on a first surface of the multilayer substrate, where a plurality of terminals are arranged along a first side of four sides defining the first surface, and a second terminal group disposed on the first surface, where a plurality of terminals are arranged along a second side that is different from the first side. The first terminal group includes a first antenna terminal of the first wireless system whereas the second terminal group includes a second antenna terminal of the second wireless system.
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