发明名称 OUTER LEAD BONDING APPARATUS
摘要 PURPOSE:To improve the mounting accuracy of a device, by making an observing part for observing an outer lead and the electrode of a board enter a space or leave it which is present between a compression-bonding tool and the outer lead of the device attracted to a suction nozzle. CONSTITUTION:An observing part (A) enters a space or leaves it which is present between a compression-bonding tool 6 and an outer lead 4 of a device 3 attracted to a suction nozzle 7. When the observation for aligning the outer lead 4 with an electrode 2 is performed, the nozzle 7 is lowered by the driving of a motor, and the space for a cylindrical body 38 is formed between the compression-bonding tool 6 and the device 3. Also, a bonding head 5 is lowered by the driving of a Z-table so as to set a start distance (d) between the outer lead 4 and the electrode 2. Further, in such a state that the outer lead 4 is close to the electrode 2, their pictures are photographed by a camera 39, and the positional correction of the device 3 is performed. Thereby, the positional discrepancy of the device 3 is suppressed, and its mounting accuracy can be improved.
申请公布号 JPH07130796(A) 申请公布日期 1995.05.19
申请号 JP19930278262 申请日期 1993.11.08
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ONIZUKA YASUTO
分类号 H01L21/60;H05K13/04 主分类号 H01L21/60
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