发明名称 Cutting or grinding jig especially for preparing and polishing silicon wafers
摘要 A grinding or cutting device for disc-shaped hardware items (1) includes a movable grinding or cutting base (3) and at least one holder for the workpiece (6). The workpiece holder (6) exerts a pressure under its own weight against the workpiece (1) and a folding device (7) is arranged for holding the at least one workpiece holder (6) over the moving grinding or cutting base (3). The workpiece holder (6) is held so that the resulting tilting or wobbling movements caused by frictional forces between the base and workpiece, in a tangential direction to the direction of movement of the cutting/grinding base (3), are minimised, so that they have no influence on the grinding/cutting result.
申请公布号 DE19853060(A1) 申请公布日期 2000.08.03
申请号 DE1998153060 申请日期 1998.11.17
申请人 SIEMENS AG 发明人 BORNHAUSER, CHRISTIAN
分类号 B24B37/04;B24B37/30;H01L21/304;(IPC1-7):B24B41/06;B24B7/16;B23Q3/00 主分类号 B24B37/04
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