| 摘要 |
PROBLEM TO BE SOLVED: To prevent the generation of wire slippings when sealing printing is performed on a wiring substrate, so as to prevent the generation of recessed parts on the surface of the material to be sealed by having sealing material in uniform thickness. SOLUTION: When a sealing printing operation is performed, first printing is performed at a low speed for a squeegee 5 at 0.1 mm/sec to 70 mm/sec, and final printing is performed at a high squeegee speed of 10 mm/sec to 300 mm/sec in this manufacturing method. [However, (final speed/first speed is in the range of 1.2 to 3,000)]. The squeegee in this squeegee device used for the manufacture of this semiconductor device is maintained in a state in which the angle to the mask 3 of the tip part of the squeegee is inclined is such a manner that the upper part of the squeegee becomes the front, and whenever the moving direction of the squeegee changes, the inclination of the squeegee is changed. |
