| 摘要 |
A semiconductor light-emitting module includes a heat-dissipating member (11,11',11~,21), a heat-conducting unit(12,22), and a diode light-emitting d evice (13,23). The heat-dissipating member is provided with an isolator memb er (14,14',14~,24) coupled on the first side (112) of the heat-dissipating m ember. The heat-dissipating member has the second side (114) corresponding t o the first side (112). The isolator member is provided with the third side (116) corresponding to the first side (112). An environment temperature arou nd the third side (116) is higher than that around the second side (114). Th e heat-conducting unit (12,22) has a flat end (122) and a contact portion (1 24). The contact portion (124) is jointed tightly with the heat-dissipating member (11,11',11~,21). The diode light-emitting device (13,23) is disposed on the flat end (122) of the heat-conducting device (12,22). |
