发明名称 VERFAHREN ZUR EINKAPSELUNG VON EINEM PHOTOVOLTAISCHEN MODUL MITTELS EINES EINKAPSELUNGSMATERIALS
摘要 In the present invention, a diaphragm (21) for pressurizing and heating encapsulating materials (4) and (7) is pre-heated to a predetermined temperature before laminating a lamination unit (1) comprising a photovoltaic module (2) and the encapsulating materials (4) and (7). As a result, one surface of the lamination unit (1) is heated by a heater (15) provided on a table (14) and the other surface is heated by the diaphragm (21), so it is possible to prevent appearance of a temperature difference between the surfaces. <IMAGE>
申请公布号 AT431968(T) 申请公布日期 2009.06.15
申请号 AT20000105318T 申请日期 2000.03.16
申请人 KANEKA CORPORATION 发明人 SUZUKI, TAKAYUKI;YAMAGISHI, HIDEO;KONDO, MASATAKA
分类号 H01L31/048;H01L21/8234;H01L23/28;H01L31/0203;H01L31/042;H01L31/18 主分类号 H01L31/048
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