发明名称 PORE-FILL COMPOSITIONS
摘要 The present invention relates to a composition comprising a polymer and a solvent, wherein the polymer comprises a repeating unit represented by Formula (I) below and an end capping group devoid of polymerizable vinyl groups and hydroxyl groups. In the above formula, Ar1, Ar2, Ar3 and Ar4 each independently represent an optionally substituted bidentate aromatic group; X1 and X2 each independently represent a single bond, -O-, -C(O)-, -C(O)O-, OC(O)-, C(O)NR1-, NR2C(O)-, -S-, -S(O)-, SO2-, or an optionally substituted C1-202 valent hydrocarbon group; R1 and R2 each independently represent H or C1-20 hydrocarbyl group; m is 0 or 1; n is 0 or 1; and o is 0 or 1. The present composition is uniquely applicable in the production of semiconductor devices forming low-k and ultralow-k dielectric materials.
申请公布号 KR20160079721(A) 申请公布日期 2016.07.06
申请号 KR20150186999 申请日期 2015.12.26
申请人 ROHM AND HAAS ELECTRONIC MATERIALS LLC;DOW GLOBAL TECHNOLOGIES LLC 发明人 EMAD AQAD;JONG KEUN PARK;PHILLIP D. HUSTAD;MINGQI LI;CHENG BAI XU;PETER TREFONAS III;JAMES W. THACKERAY
分类号 C08L71/12;C08G65/40;C08K5/01;C09D5/34 主分类号 C08L71/12
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