METHOD OF MASS PRODUCING AND PACKAGING INTEGRATED OPTICAL SUBSYSTEMS

摘要

Mass production of integrated optical subsystems may be realized by providing a bonding material surround each die in an array of first dies on a wafer. A plurality of second dies are then aligned with the dies on the wafer. The bonding material is then treated to bond the aligned dies. The bonded dies are then diced to form a bonded pair of dies containing at least one optical element, thus forming an integrated optical subsystem. The bonding material may be provided over at least part of the optical path of each first die, over an entire surface of the wafer or around the perimeter of each first die. The second dies may be provided on another wafer. Either die may contain active elements, e.g., a laser or a detector. The optical elements may be formed in the die or may be of a different material than that of the die.