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发明名称
METHOD FOR FORMING BONDING PAD FOR ELECTRIC CIRCUIT BY MICRO MACHINING
摘要
申请公布号
JPH08106614(A)
申请公布日期
1996.04.23
申请号
JP19940263313
申请日期
1994.10.04
申请人
IWATSU ELECTRIC CO LTD
发明人
SHIBANO FUMIHIKO
分类号
G11B5/31;H05K3/40;(IPC1-7):G11B5/31
主分类号
G11B5/31
代理机构
代理人
主权项
地址
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