| 摘要 |
PROBLEM TO BE SOLVED: To enable to manufacture with high precision and prevent from becoming large without lowering integration. SOLUTION: The connection structure comprises a hole 9a which penetrates from the surface to the back face of the dielectric block 8 and a metal film 10a disposed inside and surrounding the above hole and a metal film 10b which is disposed surrounding the outer periphery of the dielectric block and which is insulated with the metal film 10b. When the metal film 10a is clipped by the dielectric substrates 1a, 1b in between, in connects electrically a strip line pattern 3a and a conductive pattern 4b and functions as a signal line for transmitting a high frequency signal or a control signal, and the metal film 10b connects a conductive pattern 4a connected with the grounding conductor 5a with a grounding conductor 5b through the connecting means 6a, and the dielectric substrates 1a, 1b. By this arrangement, it facilitates connection of the dielectric substrates by piling and enables to connect stably a plurality of line formed on the dielectric substrates. |
