| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, in which a plurality of spherical semiconductor that semiconductors or wirings are formed on the surface of spherical semiconductor materials can be piled up easily at a prescribed position. SOLUTION: A spherical semiconductor 11 is placed on a recessed part that is formed on the center of three spherical semiconductors 11 in contact with each other, so that the four spherical semiconductors form a triangular cone three-dimensionally, thus forming a semiconductor device 1. The piled semiconductors 11 also include a spherical semiconductor 1 with a function for only connecting the spherical semiconductors electrically, or a dummy spherical semiconductor 11F for only burying the clearance between the spherical semiconductors 11. |
