发明名称 FRAME TYPE ELECTRIC CONNECTOR FOR LEADLESS IC PACKAGE
摘要 A frame-type electrical connector for connecting leadless integrated circuit packages to a printed circuit board is disclosed. The connector includes a frame member having generally rectangular sides. A lead frame containing a plurality of flat conductive elements is molded in place in each of the sides of the frame. After molding, the conductive elements are shaped to form both pressure contacts and pin terminals. The pressure contacts are designed to contact the leadless package, and the pin terminals are designed to be soldered into the printed circuit board.
申请公布号 JPS58216446(A) 申请公布日期 1983.12.16
申请号 JP19830016343 申请日期 1983.02.04
申请人 TEREDAIN IND INC 发明人 JIEEMUSU BURAIAN MATSUGII
分类号 H05K1/18;H01L23/32;H01R4/02;H01R33/76;H05K7/10 主分类号 H05K1/18
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