| 摘要 |
A method for fabricating a microelectromechanical or microoptoelectromechanical component has the following steps: - ~producing a first layer composite having a first substrate (2) and a first insulation layer (3), which covers at least one part of the surface (1) of the first substrate (2), - ~producing a second layer composite having a second substrate (12) and a second insulation layer (14), which covers at least one part of the surface (13) of the second substrate (12), - ~applying an at least partly conductive structure layer (7) to the first insulation layer (3), - ~applying the second composite to the structure layer (7) in such a way that the second insulation layer (14) adjoins the structure layer (7), - ~wherein the first and second layer composites and also the structure layer (7) are configured in such a way that at least one part of the structure layer (7) which comprises the active area (8) of the microelectromechanical or microoptoelectromechanical component is hermetically tightly sealed by the first and second layer composites, and - ~forming contact holes (4) for making contact with conductive regions (9) of the structure layer (7) within the first and/or second substrate (2, 12). (Figure 10) |
