ULTRASONIC SOLDER TANK

摘要

PURPOSE:To provide an ultrasonic solder tank which enables transmission of an ultrasonic wave to a molten solder tank and can assure soldering of small-sized electronic parts by disposing a horn of an attachable and detachable horn of an ultrasonic vibrator on the outside of the molten solder tank. CONSTITUTION:A horn 19 contacts with a solder tank body 15 and transmits ultrasonic oscillation via the body 15 to molten solder 16 in the case of soldering a substrate 21 to be soldered. A cavitation phenomenon is then generated in the solder 16, and the oxidized film in the part to be soldered of the substrate 21 is removed by the impact wave generated when the cavity is ruptured by the compressive wave of the powerful ultrasonic oscillation. Satisfactory soldering is thus made possible and the horn 19 is detached when the soldering of the board 21 is finished. The horn is detached for the purpose of preventing the thermal deterioration of the horn 19 and oscillator 20 as the temp. of the body 15 is high.