发明名称 |
Polishing cloth and polishing apparatus having such polishing cloth |
摘要 |
A polishing cloth mounted on a turntable of a polishing apparatus and a polishing apparatus having such a polishing cloth for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing cloth comprises a first elastic region contacting the surface of the workpiece and having a certain elastic modulus, and a second elastic region contacting the surface of the workpiece and having an elastic modulus different from the first elastic region. The second elastic region is surrounded by the first elastic region and has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the second elastic region is held in contact with the workpiece. The position of the second elastic region is determined on the basis of an area in which the second elastic region acts on the workpiece. |
申请公布号 |
US5985090(A) |
申请公布日期 |
1999.11.16 |
申请号 |
US19960650144 |
申请日期 |
1996.05.17 |
申请人 |
EBARA CORPORATION |
发明人 |
KIKUTA, RITSUO;AOYAMA, FUJIO;KATO, KOJI;TAKAHASHI, TAMAMI |
分类号 |
B24B37/00;B24B37/04;B24B37/20;B24B37/24;B24B41/047;B24D7/14;B24D13/14;H01L21/304;(IPC1-7):C23F1/02;B44C1/22 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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