| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor module capable of being miniaturized and a driving device for hybrid vehicle equipped with it. <P>SOLUTION: A bus bar 40P constitutes a power supply line and another bus bar 40N constitutes an earth line. The bus bars 40P, 40N are laminated in the direction of normal line of an insulating substrate 50 through an insulating member. In this case, the bus bar 40P positioned at the side of an upper layer is constituted of a metallic member, while the bus bar 40N positioned at the side of a lower layer is constituted of a wiring layer formed on the insulating substrate 50. One side of the bus bar is fixed to the insulating substrate 50 as the wiring layer whereby the heat dissipation of the bus bar is secured. According to this method, the bus bar can be constituted of a wiring layer comparatively small in the sectional area thereof whereby the semiconductor module can be miniaturized in the direction of normal line. The semiconductor module is mounted on the driving device for hybrid vehicle whereby the same can be miniaturized in the vertical direction upon mounting the same on the vehicle, while the running stability of the vehicle can be improved by lowering the position of center of gravity of the vehicle. <P>COPYRIGHT: (C)2007,JPO&INPIT |
