| 摘要 |
The present invention relates to an apparatus for treating a wafer. The apparatus for treating a wafer includes a wafer cradle portion. The wafer cradle portion is rotatably installed while a wafer is seated thereon. A fixing bar is provided to extend in a direction having a radius direction component on the lower side of the wafer. The fixing bar has a flow formation portion downwardly protruding to be inclined with respect to a direction perpendicular to the fixing bar to generate a flow downwardly according to the rotation of the fixing bar. An air flow is formed downwardly by the flow formation portion downwardly protruding to be inclined with respect to the direction perpendicular to the fixing bar of the wafer cradle portion spinning while the wafer is seated and supported. While a treating process such as washing, cleansing, and drying while the wafer seated on the wafer cradle portion is performed, a cleaning solution, a cleansing solution, or an air flow blowing the surface of the wafer can be sucked to the lower side of the wafer to be discharged without being floated on the upper side of the wafer, thus preventing the secondary pollution of the wafer and improving drying efficiency and cleaning efficiency. |
