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发明名称
BOUBLE-FREE SOLDER PRINT PATTERN OF MOUDLE
摘要
申请公布号
KR200183623(Y1)
申请公布日期
2000.06.01
申请号
KR19940023633U
申请日期
1994.09.13
申请人
DAEWOO ELECTRONIC COMPONENTS CO.,LTD.
发明人
YOO, DONG CHUL
分类号
H05K1/18;(IPC1-7):H05K1/18
主分类号
H05K1/18
代理机构
代理人
主权项
地址
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