SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURE THEREOF, CIRCUIT BOARD, AND ELECTRONIC DEVICE

摘要

A first semiconductor chip (10) is mounted on a substrate (70) having a wiring pattern (72) in such a manner that the substrate is opposed to electrodes (12) formed on one surface of the first chip. A second semiconductor chip (20) is mounted on the first semiconductor chip (10), and electrodes (22) are connected electrically with the wiring pattern (72) through wires (26). The first resin filled between the substrate (70) and the first semiconductor chip (10) is different from the second resin that molds the first and second semiconductor chips (10, 20).