POLISHING METHOD USING FIXED ABRASIVE PAD

摘要

PROBLEM TO BE SOLVED: To provide a polishing method using a fixed abrasive pad capable of polishing a wafer without using a polishing liquid in a polishing step or deteriorating a processing characteristic such as increase of micro scratch or deterioration in uniformity in a face.

SOLUTION: A suspension type wettable fixed abrasive pad 3 is made into a sufficiently wet condition with pure water or processing liquid mainly composed of pure water. After the pad surface is adjusted into such a wet condition as capable of suspending abrasive from the pad in a polishing process, polishing is conducted without supplying the polishing liquid during polishing.

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