| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic element package and a manufacturing method thereof. <P>SOLUTION: The manufacturing method of the electronic element package includes (a) a step of forming a protrusion portion on a first carrier plate; (b) a step of laminating an insulating layer on the first carrier plate to form a circuit pattern including a bonding pad and a solder ball pad on the surface of an insulating layer; (c) a step of mounting an electronic element on the surface of the insulating layer and electrically coupling the electronic element to the bonding pad; and (d) a step of eliminating the first carrier plate and the protruding portion. The method can mount the electronic element with only one circuit pattern layer. <P>COPYRIGHT: (C)2008,JPO&INPIT |
