CONTACT STRUCTURE FOR VERTICAL CHIP CONNECTIONS

摘要

PCT No. PCT/DE94/00492 Sec. 371 Date Nov. 3, 1995 Sec. 102(e) Date Nov. 3, 1995 PCT Filed May 3, 1994 PCT Pub. No. WO94/25982 PCT Pub. Date Nov. 10, 1994A semiconductor component having a contact structure for making vertical contact with further semiconductor components and having a substrate (15) which has on a top side with a layer structure having regions with which contact is to be made, includes at least one metal pin (8) which penetrates the substrate (15) perpendicularly with respect to the layer structure. The substrate (15) is thinned until the metal pin (8) projects beyond the underside of the substrate. Metal contacts (12) made of metal having a low melting point are present, if appropriate, on the top side of the component.