| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for semiconductor device which is superior in mass productivity and allows the cost to be reduced, semiconductor device, manufacture thereof, and electronic device. SOLUTION: This substrate 1 for semiconductor devices on which a semiconductor element 14 to be wire-bonded is mounted to constitute a semiconductor device 10 has a substrate body 18, a plurality of leads 20, 22, 24 formed on a mounting surface of the semiconductor element 14, and a conductive part 26 electrically connected to each lead to form at least a part of outer terminals. A part of the lead 20 is located below the semiconductor element 14 according to the size of the semiconductor element 14, and the remainder is located outside the semiconductor element 14. |
