METHOD FOR MANUFACTURING SEMICONDUCTOR HEAT SPREADER

摘要

The present invention provides a method for manufacturing a semiconductor heat spreader. The method for manufacturing a semiconductor heat spreader comprises: a step (S60) of forming a copper sulphate plating film by applying copper sulphate on a base member including a copper component; a step (S70) of forming a first nickel strike plating film by applying nickel on a surface of the copper sulphate plating film formed in the step (S60) through a nickel strike plating method; a step (S80) of forming an electroless nickel plating film by applying nickel on a surface of the first nickel strike plating film formed in the step (S70) through an electroless nickel plating method; a step (S90) of forming a second nickel strike plating film by applying nickel on a surface of the electroless nickel plating film through a nickel strike plating method; and a step of forming an anti-tarnishing coating film by applying an organic material for anti-tarnishing and coating on a surface of the second nickel strike plating film. Therefore, according to the present invention, it is possible to manufacture the semiconductor heat spreader in which an adhesive force and a durability of a plated metal are strengthened.