| 摘要 |
An apparatus and method for achieving alignment of a photosensor array in an imaging device is disclosed. The photosensor array is mounted in an integrated circuit package having a plurality of downwardly extending leads. The leads are received in a plurality of sockets which are attached to and extend through the retina board. A pair of holes are provided extending through the retina board proximate the ends of the integrated circuit package. An actuator, such as a screw, is associated with each hole such that the actuator is able to contact the rear surface of the integrated circuit package. In this manner, one of the actuators may be used to apply a force to one end of the integrated circuit package in order to move that end away from the retina board and thus achieve alignment with the light beam. After the desired alignment has been achieved, some of the integrated circuit package leads may be soldered within their respective sockets in order to lock the integrated circuit package and photosensor array in place. Alternatively, some of the sockets may be omitted such that the corresponding integrated circuit package leads may be soldered directly to the retina board in order to lock the package in place. |
