发明名称 LEAD FRAME
摘要 PROBLEM TO BE SOLVED: To make the thickness of a Pd plated film in an intermediate portion in a widthwise direction on a lead frame on which the Pd plated film is formed by passing through an electro plating or an electroless plating line. SOLUTION: In a lead frame on which a Pd plating film is formed by passing through the electro plating or the electroless plating line, the uniformity of the thickness of Pd plated film in the intermediate portion in the widthwise direction is obtained by making the amount of Pd to zero or significantly reducing the amount of Pd in both ends in the widthwise direction of the lead frame. Even if the thickness of the Pd plated film in the intermediate portion in the widthwise direction is ultra-thin, the intermediate portion in the widthwise direction of the lead frame chain where the uniform thickness of the Pd plated film is required can be plated uniformly without defective spots by forming the thickness of Pd plated film in both ends in the widthwise direction of the lead frame becomes less than the thickness of that in the intermediate portion in the widthwise direction by 25% maximum. In addition, reducing the Pd precipitation contributes to cost reduction.
申请公布号 JP2002164493(A) 申请公布日期 2002.06.07
申请号 JP20000361652 申请日期 2000.11.28
申请人 MITSUI HIGH TEC INC;FURUKAWA SEIMITSU KINZOKU KOGYO KK;SUMITOMO METAL MINING CO LTD;NOGE DENKI KOGYO:KK 发明人 YAMAURA DAIGO;TACHIHARA KAZUO;TANAKA SHIGEHARU;IWADARE KATSUHIRO
分类号 C23C18/16;C25D7/06;C25D7/12;H01L23/50;(IPC1-7):H01L23/50 主分类号 C23C18/16
代理机构 代理人
主权项
地址