MASKING ARRANGEMENT FOR MASKING A SUBSTRATE DURING A DEPOSITION PROCESS, DEPOSITION APPARATUS FOR LAYER DEPOSITION ON A SUBSTRATE, AND METHOD FOR CLEANING A MASKING ARRANGEMENT

摘要

A masking arrangement (100) for masking a substrate (10) during a deposition process is provided. The masking arrangement (100) includes one or more surface areas (130) configured for exposure to a material deposition source during the deposition process, wherein the one or more surface areas (130) are at least partially coated with a solder (140).