DEVICE AND METHOD FOR PROCESSING SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a device and a method for processing a semiconductor wafer avoiding wafer contamination and efficiently cooling a mounting pedestal of the semiconductor wafer after heating, thereby improving the throughput. SOLUTION: The device 1 for processing the semiconductor wafer includes: a chamber 3 for housing the semiconductor wafer W; and the wafer mounting pedestal 5 provided in the chamber 3 and having a mounting surface 7 for mounting the semiconductor wafer W. The device 1 for processing the semiconductor wafer processes the semiconductor wafer W in the chamber 3 by heating the mounting surface 7, while heating the semiconductor wafer W. The device 1 also includes a mounting-surface-cooling part 21 for cooling the mounting surface 7, and the mounting-surface-cooling part 21 has a cooling gas path 23 embedded in the wafer mounting pedestal 5 to get the gas for cooling through. COPYRIGHT: (C)2009,JPO&INPIT