发明名称 Catalyst solution for electroless deposition of metal on substrate
摘要 The invention described herein is a catalyst for activating a substrate for the initiation of electroless metal plating and to a process for making the same. The catalyst comprises the product resulting from the admixture of an acid soluble salt of a catalytic metal; the addition product believed to be formed from a solution soluble stannous salt, an acid and urea; and preferably, an extraneous source of halide ions. The catalyst of the invention differs from prior art catalysts in that it has greater stability, does not fume, is lower in cost to make and use and, in the preferred embodiment employing the extraneous source of halide ions, may be operated at lower acidity (high pH) than the prior art catalysts.
申请公布号 US3874882(A) 申请公布日期 1975.04.01
申请号 US19730415526 申请日期 1973.11.14
申请人 SHIPLEY COMPANY, INC. 发明人 GULLA, MICHAEL;CONLAN, WILLIAM A.
分类号 C23C18/28;(IPC1-7):C23C3/00 主分类号 C23C18/28
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