| 摘要 |
PROBLEM TO BE SOLVED: To provide a bump bonding system which enables to plan reduction and suppress the residual vibration that occurs when a metal ball touches the member to form bumps and to form and bond the bumps of good quality to satisfy narrowing of die center distance of an IC. SOLUTION: The trial of a bonding actuation consists of comparing at first the reference weighted profile instruction with the weighted value that is measured by a weighting sensor 15 during a bonding actuation based on the profile instruction to generate a corrected weighting instruction, comparing next the weighted profile value that is measured by weighting sensor 15 during the bonding actuation based on the corrected weighted profile instruction to generated a further corrected weighted profile instruction, and finally generating the actual weighter profile instruction given to a motor control part 11 by repeating the correction operation. |
