发明名称 METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND DOUBLE SIDE EXPOSING TOOL
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed wiring board whereby the centers of target marks formed on inner layers cores, corresponding to their positions, hardly deviate from each other, and a double side exposing tool effective for accurately and easily forming the target marks on the inner layers cores. SOLUTION: The exposing tool 1 uses a combination of a film 3 having an exposure pattern 5A with a glass dry plate 2 having an exposure pattern 5B and positioning hole marks and target marks are formed, using the exposure pattern 5B of the dry plate 2.
申请公布号 JP2002016358(A) 申请公布日期 2002.01.18
申请号 JP20000331161 申请日期 2000.10.30
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SATO KOJI;TASHIRO HIROSHI;OGAWA HIROSHI
分类号 G03F7/20;G03F9/00;H05K3/00;H05K3/46;(IPC1-7):H05K3/46 主分类号 G03F7/20
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