发明名称 |
Resin plating method with added heat-treating process |
摘要 |
A resin plating method for a resin molding is disclosed which involves a simple process as an additional process in resin plating to suppress the occurrence of such an undesirable phenomenon as a metal plating film peeling together with a thin resin film due to floating of a thin surface film of the resin molding. A specific portion of the resin molding which portion is apt to undergo peeling of a thin surface resin film is heat-treated at a high temperature and thereafter resin plating is performed.
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申请公布号 |
US2007099418(A1) |
申请公布日期 |
2007.05.03 |
申请号 |
US20050561966 |
申请日期 |
2005.05.11 |
申请人 |
KAKIHARA KUNIHIRO;NODA YOSHINORI |
发明人 |
KAKIHARA KUNIHIRO;NODA YOSHINORI |
分类号 |
H01L21/47 |
主分类号 |
H01L21/47 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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