发明名称 SUBSTRATE FOR PRINTED WIRING FORMATION AND PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a substrate for printed wiring formation, capable of forming a printed wiring with high dimensional accuracy, capable of effectively suppressing generation of disconnections of a printed wiring even when being folded with a radius of curvature less than or equal to 0.5 mm.SOLUTION: The substrate for printed wiring formation includes: a flexible base body; and a receptive layer formed on the base body. The cross-linked polymer has a glass transition temperature of less than or equal to 30°C. The storage elastic modulus at 150°C is 7×10to 3×10Pa.SELECTED DRAWING: Figure 1
申请公布号 JP2016154217(A) 申请公布日期 2016.08.25
申请号 JP20150248581 申请日期 2015.12.21
申请人 FUJIKURA LTD 发明人 TACHIKAWA YASUYUKI
分类号 H05K3/12;H05K1/02 主分类号 H05K3/12
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