发明名称 WIRING BOARD AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a wiring board which achieves excellent component mountability in a recessed part.SOLUTION: A wiring board (10) includes: wiring layers (16) which are laminated; an insulation layer (18-4) having a surface (17) and a surface (19) on which a wiring layer (16-4) and a wiring layer (16-5) of the wiring layers (16) are respectively provided; a cavity (24) which is recessed from a surface (17) side to a middle part of the insulation layer (18-4); and a connection part (22-4) which is electrically connected with the wiring layer (16-5) and is provided at the insulation layer (18-4) so as to be exposed on a bottom surface of the cavity (24). The connection part (22-4) has: an exposed surface (26) exposed on the bottom surface of the cavity (24); a connection surface (28) which contacts with the wiring layer (16-5); and a side surface (30) which contacts with the insulation layer (18-4). The side surface (30) inclines.SELECTED DRAWING: Figure 2
申请公布号 JP2016162977(A) 申请公布日期 2016.09.05
申请号 JP20150042917 申请日期 2015.03.04
申请人 EASTERN CO LTD 发明人 YAMAMOTO KENICHI;ASAKURA CHIAKI;KUMAZAWA TAKAHIRO
分类号 H05K3/46 主分类号 H05K3/46
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